师资队伍
高分子材料
陈超
陈超，博士，副教授，硕士生导师
办公地点：材料学院6027
个人简介：2008年毕业于湖北大学，材料化学学士学位; 2016年毕业于华中科技大学，材料物理与化学博士学位。研究兴趣是聚合物复合材料加工过程中的物理、化学结构变化，通过新型填料开发和加工方法设计，制备高性能导热复合材料。以通讯/第一作者发表国际期刊论文15篇,获中国专利8项。主持国自然青年项目1项，参与国自然重大国际合作项目1项。
主要发表论文:
(1) Kailun Zhang, Chao Chen, Yingfeng Wen, Xinxin Xu，Hao Ni, Weiwei Lei, Xiaoming Ren, Jun You, Qunchao Zhang, Dean Shi. Directional thermal transport feature in binary filler-based SiR composites with horizontally orientedh-BN.Compos. Sci. Technol., 2024, 254: 110666.
(2) Jinbao Song, Kailun Zhang, Zihao Guo, Tianqi Liang, Chao Chen, Jie Liu, Dean Shi, h-BN orientation degree on the thermal conductivity anisotropy of their silicone rubber composites: A quantitative study,Compos.Part A: Appl. Sci. Manuf., 2023, 166(107389):107389.
(3) Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, Dean Shi, Guo-Hua Hu, Xiaolin Xie, Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability,Compos. Sci. Technol., 2021, 209: 108760.
(4) Chao Chen, Yang Xue, Xiongwei Li, Yingfeng Wen, Jinwei Liu, Zhigang Xue, Dean Shi, Xingping Zhou, Xiaolin Xie, Yiu-Wing Mai, High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging,Compos.Part A: Appl. Sci. Manuf., 2019, 118: 67-74
(5) Chao Chen, Yang Xue, Zhi Li, Yingfeng Wen, Xiongwei Li, Fan Wu, Xiaojing Li, Dean Shi, Zhigang Xue, Xiaolin Xie, Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles,Chem. Eng. J., 2019, 369: 1150-1160.
(6) Chao Chen, Hongjian Wang, Yang Xue, Zhigang Xue, Hongyuan Liu, Xiaolin Xie, Yiu-Wing Mai, Structure, rheological, thermal conductive and electrical insulating properties of high-performance hybrid epoxy/nanosilica/AgNWs nanocomposites.Compos. Sci. Technol., 2016, 128: 207-214.
(7) Chao Chen, Yongjun Tang, Yun-Sheng Ye, Zhigang Xue, Yang Xue, Xiaolin Xie, Yiu-Wing Mai, High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging,Compos. Sci. Technol., 2014, 105: 80-85